Program Chairs


Technical Program Committee

  • Ahmed Jerraya, CEA
  • Alberto Sangiovanni-Vincentelli, University of California, Berkeley
  • Alex Orailoglu, University of California, San Diego
  • Andreas Gerstlauer, Universtiy of Texas, Austin
  • Andreas Kuehlmann, Cadence
  • Andy Pimentel, University of Amsterdam
  • Ann Gordon-Ross, University of Florida, Gainsville
  • Aviral Shrivastava, Arizona State University
  • Axel Jantsch, KTH Royal Institute of Technology
  • Bashir Al-Hashimi, University of Southampton
  • Catherine H. Gebotys, University of Waterloo
  • Christian Haubelt, University of Erlangen-Nuremberg
  • Christian Sebeke, Bosch, Germany
  • Christos Bouganis, Imperial College, London
  • Dan Gajski, University of California, Irvine
  • Dimitrios Serpanos, University of Patras
  • Donald Thomas, Carnegie Mellon University
  • Donatella Sciuto, Politecnico di Milano, Italy
  • Edwin Sha, University of Texas, Dallas
  • Erwin de Kock, NXP Semiconductors
  • Fabian Wolf, Volkswagen, Germany
  • Fadi J. Kurdahi, University of California, Irvine
  • Franco Fummi Universtiy of Verona
  • Frank Vahid, University of California, Riverseide
  • Gero Dittmann, IBM
  • Grant Martin, Tensilica
  • Hiroyuki Tomiyama, Nagoya University
  • Jan Madsen, Technical University of Denmark
  • Jianwen Zhu, University of Toronto
  • Joann Paul, Virginia Tech
  • Joerg Henkel, Karlsruhe Institute of Technology
  • John Bainbridge, Silistix
  • Juergen Teich, University of Erlangen-Nuremberg
  • Karam S. Chatha, Arizona State University
  • Kazutoshi Wakabayashi, NEC, Japan
  • Kees Goossens, TU Delft
  • Kiyoung Choi, Seoul National University
  • Lars Bauer, Karlsruhe Institute of Technology
  • Laura Pozzi, University of Lugano
  • Luca Benini, University of Bologna
  • Luciano Lavagno, Cadence
  • Luigi Carro, UFRGS, Brazil
  • Marilyn Wolf, Georgia Tech
  • Maurizio Palesi, University of Catania
  • Miguel Miranda, IMEC
  • Mitsuo Saito, Toshiba
  • Naehyuck Chang, Seoul National University
  • Niraj Jha, Princeton University
  • Oliver Bringmann, FZI Karlsruhe
  • Pai H. Chou, University of Califronia, Irvine
  • Pao-Ann Hsiung, National Chung Cheng University
  • Paul Pop, Technical University of Denmark
  • Per Gunnar Kjeldsberg, Norwegian University of Science and Technology
  • Peter Grun, ARM
  • Peter Marwedel, TU Dortmund
  • Petru Eles, Linkvping University
  • Prabhat Mishra, University of Florida
  • Preeti R. Panda, Indian Institute of Technology, Delhi
  • Radu Marculescu, Carnegie Mellon University
  • Rainer Doemer, University of California, Irvine
  • Rajesh Gupta, University of California, San Diego
  • Reinaldo Bergamaschi, CadComponents
  • Robert Dick, University of Michigan, Ann Arbor
  • Robert Walker, Kent State University
  • Rolf Ernst, TU Braunschweig
  • Roman Hermida, University of Madrid
  • Roman Lysecky, University of Arizona
  • Samarjit Chakraborty, TU Munich
  • Scott A. Mahlke, University of Michigan, Ann Arbor
  • Soonhoi Ha, Seoul National University
  • Sri Parameswaran, University of New South Wales
  • Steve Edwards, Columbia University
  • Sudarshan Banerjee, University of California, Irvine
  • Sudeep Pasricha, Colorado State University
  • Sungjoo Yoo, Postech Pohang University of Science and Technology
  • Taewhan Kim, Seoul National University
  • Tim Kogel, CoWare
  • Todor Stefanov, Leiden University
  • Tor Jeremiassen, Texas Instruments
  • Vincent Mooney, Georgia Tech
  • Wido Kruijtzer, Virage Logic
  • Wolfgang Ecker, Infineon
  • X. Sharon Hu, University of Notre Dame
  • Yosinori Watanabe, Cadence
  • Youn-Long Steve Lin, National Tsing Hua University
  • Yuan Xie, Pennsylvania State University
  • Yukihiro Nakamura, Kyoto University
  • Yung-Hsiang Lu, Purdue University

Important Dates

  • Abstract submission (extended)
    Tuesday, April 06st, 2010

  • Full paper submission (hard)
    Sunday, April 11th, 2010

  • Notification of acceptance
    Monday, June 28th, 2010

  • Camera ready version
    Tuesday, August 10th, 2010

ESWEEK

CODES+ISSS Home

Programme Committee

Registration

Venue and Travel

Previous Conferences

How to become a sponsor
Sponsoring societies
sigda sigbed sigmicro ieee-cas ieee-computer ceda
In cooperation with
ifip
Premium contributor
Industrial/academic contributors